Thermal Grizzly - Carbonaut 38x38x0.2mm – Reusable Carbon Thermal Pad, Non-Adhesive, Flexible & High Conductivity

XTM70 Extreme Performance Thermal Paste enables maximum heat transfer from your high-end processor and components so they can stay reliably cool, during even the most intense tasks and overclocking. XTM70 spreads evenly and cleanly due to its low viscosity, resulting in peak thermal transfer on Intel and AMD processors up to 250W TDP and higher. The included applicator kit makes it easy to apply an even layer onto a cold plate, alongside three included cleaning wipes to handily remove old paste from your hardware. With 3g of non-electrically conductive paste, XTM70 helps support extreme CPU cooling and lower temperatures without drying or cracking.

The minus pad 8 combines good thermal conductivity with a soft and flexible structure. It is designed to ensure optimal heat transfer. Thanks to its high adaptability, it perfectly compensates for surface irregularities and ensures even heat distribution.The minus pad 8 is the ideal choice for anyone in need of a reliable thermal interface solution. With its high compressibility, it adapts to different surfaces and enables efficient heat dissipation, even with low contact pressure.The minus pad 8 is available in 30x30mm, 100x100mm & 120x20mm sizes, with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm. Set packs are also available for some sizes.

The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. A high contact pressure of around 300-400N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material, thus minimizing the pump-out effect. The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heatspreader and the base plate to deform (concave or convex) and return to their original shape (straight) when they cool down. As a result, the thermal paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example. Outstanding thermal conductivity consistently high performance Very long service life Versatile in application Not electrically conductive Easy to use PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. PhaseSheet PTM develops and stabilizes its maximum thermal conductivity after around ten thermal cycles above 60 degrees Celsius. Scope of Delivery 1x PhaseSheet PTM