The minus pad 8 combines good thermal conductivity with a soft and flexible structure. It is designed to ensure optimal heat transfer. Thanks to its high adaptability, it perfectly compensates for surface irregularities and ensures even heat distribution.The minus pad 8 is the ideal choice for anyone in need of a reliable thermal interface solution. With its high compressibility, it adapts to different surfaces and enables efficient heat dissipation, even with low contact pressure.The minus pad 8 is available in 30x30mm, 100x100mm & 120x20mm sizes, with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm. Set packs are also available for some sizes.
Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
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