Thermal Grizzly - TG Putty Advance 30g Electrically Non-Conductive Thermal Putty for GPU Modding & Thermal Pad Replacemet

The minus pad 8 combines good thermal conductivity with a soft and flexible structure. It is designed to ensure optimal heat transfer. Thanks to its high adaptability, it perfectly compensates for surface irregularities and ensures even heat distribution.The minus pad 8 is the ideal choice for anyone in need of a reliable thermal interface solution. With its high compressibility, it adapts to different surfaces and enables efficient heat dissipation, even with low contact pressure.The minus pad 8 is available in 30x30mm, 100x100mm & 120x20mm sizes, with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm. Set packs are also available for some sizes.

XTM70 Extreme Performance Thermal Paste enables maximum heat transfer from your high-end processor and components so they can stay reliably cool, during even the most intense tasks and overclocking. XTM70 spreads evenly and cleanly due to its low viscosity, resulting in peak thermal transfer on Intel and AMD processors up to 250W TDP and higher. The included applicator kit makes it easy to apply an even layer onto a cold plate, alongside three included cleaning wipes to handily remove old paste from your hardware. With 3g of non-electrically conductive paste, XTM70 helps support extreme CPU cooling and lower temperatures without drying or cracking.

Thermal Grizzly TG Putty Advance is an electrically non-conductive alternative to traditional thermal pads, specifically designed for GPU modifications and the replacement of thermal pads between the PCB and cooler. As an easily applicable and flexible gap filler, it compensates for height differences, making it ideal for replacing thermal pads on graphics cards. Typically, multiple types of thermal pads with varying heights are used in factory settings; TG Putty simplifies this by adapting to different component heights. Application can be done using the included spatulas for broad coverage or by hand (gloves recommended) by forming small beads tailored to the target surface, such as VRAM or SMD components. TG Putty effectively bridges height differences from 0.2 mm to 3.0 mm. It is available in three variants—Basic with moderate thermal conductivity, Advance with good thermal conductivity, and Pro with very good thermal conductivity—to cater to diverse cooling requirements. Before application, ensure that the target surface is thoroughly cleaned and degreased, using TG Cleaning Wipes or standard isopropanol, to achieve optimal results.