Thermal Grizzly - TG Putty Advance 30g Electrically Non-Conductive Thermal Putty for GPU Modding & Thermal Pad Replacemet
Thermal Grizzly - TG Putty Advance 30g Electrically Non-Conductive Thermal Putty for GPU Modding & Thermal Pad Replacemet
Related Item
About This Item
- General
- Brand: Thermal Grizzly
- Model Number: TG-P-A-030-R
- Product Name: Thermal Grizzly TG Putty Advance 30g Electrically Non-Conductive Thermal Putty for GPU Modding & Thermal Pad Replacemet
- Other
- Tools Included: TG Putty advance 30g
- Tool Type: Thermal Pad
- UPC: 4260711991202
TG Thermal Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible “gap filler”, it compensates for height differences, making it an ideal replacement for thermal pads on graphics cards.Thermal Putty is applied either with a spatula or by hand. It can be spread over a large surface or shaped into small beads, perfectly adapting to the surface it is applied to. It compensates for height differences ranging from 0.2 to 3.0 mm, ensuring optimal thermal transfer.Choose the thermal conductivity that suits your project: Basic, Advanced, or Pro. Whether for standard applications or high-end cooling, TG Thermal Putty provides the ideal solution.
- Electrically non-conductive: Electrically non-conductive thermal putty ideal for replacing traditional thermal pads in GPU modifications.
- Flexible gap filler: Flexible gap filler that compensates for height differences between components, ensuring optimal thermal contact.
- Easy application: Easy application using included spatulas or by hand; recommended to wear gloves during manual application.
- Effectively bridges: Effectively bridges height differences ranging from 0.2 mm to 3.0 mm for versatile use across various components.
- Available in three variants: Available in three variants—Basic, Advance, and Pro—offering different levels of thermal conductivity to suit specific needs.
Whats Included
- 1
Product Manuals
Reviews
Customer Images
The vast majority of our reviews come from verified purchases. Reviews from customers may include My Best Buy members, employees, and Tech Insider Network members (as tagged). Select reviewers may receive discounted products, promotional considerations or entries into drawings for honest, helpful reviews.
Compare similar products
TG Thermal Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible “gap filler”, it compensates for height differences, making it an ideal replacement for thermal pads on graphics cards.Thermal Putty is applied either with a spatula or by hand. It can be spread over a large surface or shaped into small beads, perfectly adapting to the surface it is applied to. It compensates for height differences ranging from 0.2 to 3.0 mm, ensuring optimal thermal transfer.Choose the thermal conductivity that suits your project: Basic, Advanced, or Pro. Whether for standard applications or high-end cooling, TG Thermal Putty provides the ideal solution.
The minus pad 8 combines good thermal conductivity with a soft and flexible structure. It is designed to ensure optimal heat transfer. Thanks to its high adaptability, it perfectly compensates for surface irregularities and ensures even heat distribution.The minus pad 8 is the ideal choice for anyone in need of a reliable thermal interface solution. With its high compressibility, it adapts to different surfaces and enables efficient heat dissipation, even with low contact pressure.The minus pad 8 is available in 30x30mm, 100x100mm & 120x20mm sizes, with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm. Set packs are also available for some sizes.
Kryonaut extreme was developed to meet the highest demands in extreme overclocking. With ultra-fine particles and optimized layer thickness, the paste maximizes thermal conductivity, making it perfect for setups using liquid nitrogen or water cooling systems
The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. A high contact pressure of around 300-400N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material, thus minimizing the pump-out effect. The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heatspreader and the base plate to deform (concave or convex) and return to their original shape (straight) when they cool down. As a result, the thermal paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example. Outstanding thermal conductivity consistently high performance Very long service life Versatile in application Not electrically conductive Easy to use PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. PhaseSheet PTM develops and stabilizes its maximum thermal conductivity after around ten thermal cycles above 60 degrees Celsius. Scope of Delivery 1x PhaseSheet PTM
