Thermal Grizzly - Minus Pad 8 120x20x1.0mm – Non-Conductive Thermal Pad with High Conductivity for SSDs,GPUs & Electronics
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About This Item
- General
- Brand: Thermal Grizzly
- Product Name: Thermal Grizzly Minus Pad 8 120x20x1.0mm – Non-Conductive Thermal Pad with High Conductivity for SSDs,GPUs & Electronics
- Other
- Tools Included: Minus Pad 8-120x20x1.0
- Tool Type: Thermal Pad
- UPC: 753677507333
The minus pad 8 combines good thermal conductivity with a soft and flexible structure. It is designed to ensure optimal heat transfer. Thanks to its high adaptability, it perfectly compensates for surface irregularities and ensures even heat distribution.The minus pad 8 is the ideal choice for anyone in need of a reliable thermal interface solution. With its high compressibility, it adapts to different surfaces and enables efficient heat dissipation, even with low contact pressure.The minus pad 8 is available in 30x30mm, 100x100mm & 120x20mm sizes, with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm. Set packs are also available for some sizes.
- 8W/(m·K) THERMAL CONDUCTIVITY: Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
- COMPATIBILITY: Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
- UPGRADE: Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
- GREAT RESULTS: The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
- USECASE: This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
- 8W/(m·K) THERMAL CONDUCTIVITY: Highly conductive and versatile, suitable for a wide range of configurations with basic to high requirements.
- COMPATIBILITY: Suitable for use with computers, laptops, PS3/4/5, Xbox 360/One/Series X consoles and Macbooks.
- UPGRADE: Designed for office, home, and gaming computers, catering to users who demand optimal performance from their equipment.
- GREAT RESULTS: The ceramic silicone and nano-aluminum oxide thermal pad effectively dissipates heat between components by filling small gaps with its flexible, highly conductive structure.
- USECASE: This is used in situations where thermal paste is not feasible, such as when dealing with a big air gap or an uneven substrate.
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The minus pad 8 combines good thermal conductivity with a soft and flexible structure. It is designed to ensure optimal heat transfer. Thanks to its high adaptability, it perfectly compensates for surface irregularities and ensures even heat distribution.The minus pad 8 is the ideal choice for anyone in need of a reliable thermal interface solution. With its high compressibility, it adapts to different surfaces and enables efficient heat dissipation, even with low contact pressure.The minus pad 8 is available in 30x30mm, 100x100mm & 120x20mm sizes, with thickness options of 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm. Set packs are also available for some sizes.
Thermal Grizzly’s Carbonaut high-tech carbon pads are an excellent alternative to thermal pastes. They feature a highly elastic and adaptable surface with exceptional thermal conductivity and extreme durability.Unlike conventional thermal pastes, Carbonaut remains permanently stable and does not dry out. It offers consistently high cooling performance even after prolonged use and effectively minimizes thermal hotspots.Thanks to its flexible structure, the Carbonaut pad can be easily applied and removed. It adapts perfectly to contact surfaces and leaves no residue. Ideal for applications where repeated use is required.
The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. A high contact pressure of around 300-400N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material, thus minimizing the pump-out effect. The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heatspreader and the base plate to deform (concave or convex) and return to their original shape (straight) when they cool down. As a result, the thermal paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example. Outstanding thermal conductivity Consistently high performance Very long service life Versatile in application Not electrically conductive Easy to use PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. PhaseSheet PTM develops and stabilizes its maximum thermal conductivity after around ten thermal cycles above 60 degrees Celsius. Scope of Delivery 1x PhaseSheet PTM
Kryonaut thermal paste offers exceptional thermal conductivity and remains stable even at high temperatures without curing, ideal for extreme cooling demands
