Gelid Solutions - HeatPhase Ultra for Intel, 40x30x0.2mm, 8.5W/mk Thermal Pad for CPU
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About this product
The Gelid Solutions HeatPhase Ultra for Intel is a 40x30x0.2mm phase-change thermal pad with 8.5W/mK thermal conductivity, engineered as a mess-free alternative to thermal paste for consistent, long-lasting heat transfer between Intel CPUs and coolers.
Features
Feature
Phase-change thermal pad with 8.5W/mK conductivity for mess-free, consistent CPU cooling.
Specifications
- BrandGelid SolutionsProduct NameGelid Solutions HeatPhase Ultra for Intel, 40x30x0.2mm, 8.5W/mk Thermal Pad for CPUTools IncludedThermal PadTool TypeThermal PadUPC4897025783836BSINCGCL3S7X2S
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Compare similar products
The Gelid Solutions HeatPhase Ultra for Intel is a 40x30x0.2mm phase-change thermal pad with 8.5W/mK thermal conductivity, engineered as a mess-free alternative to thermal paste for consistent, long-lasting heat transfer between Intel CPUs and coolers.
Gelid Solutions GC-4 is a 1g high-performance thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.
The Gelid Solutions HeatPhase Ultra for AMD is a 40x40x0.2mm phase-change thermal pad with 8.5W/mK thermal conductivity, engineered as a mess-free alternative to thermal paste for consistent, long-lasting heat transfer between AMD CPUs and coolers.
Gelid Solutions GN-Ultimate is a 50g, 6W/mK thermal putty designed for filling larger gaps between components and coolers, compatible with Intel and AMD platforms for high-performance, long-lasting heat transfer.
Specs
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