Gelid Solutions - A GC-4-1g Thermal Compound
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About this product
Gelid Solutions GC-4 is a 1g high-performance thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.
Feature
High-performance thermal compound with over 8.5W/mK conductivity and non-conductive formula.
- BrandGelid SolutionsProduct NameGelid Solutions A GC-4-1g Thermal CompoundTools IncludedThermal CompoundTool TypeThermal CompoundUPC4897025783690BSINCGCL3S725Q
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Gelid Solutions GC-4 is a 1g high-performance thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.
Gelid Solutions GC-4 is a 10g high-performance thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.
The Gelid Solutions GC-4 is a 3.5g thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.
The Gelid Solutions GC-Extreme is a premium 1g syringe of thermal conductive paste with 8.5W/mK thermal conductivity, delivering excellent heat transfer between CPUs, GPUs, or chipsets and their coolers for lower operating temperatures.
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