Gelid Solutions - Gelid Solution TC-GC-03-D GC-Extreme - Thermal Conductive Paste for Heatsink (1g)

Gelid Solutions GC-4 is a 1g high-performance thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.

The Gelid Solutions GC-4 is a 3.5g thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.

The Gelid Solutions Thermal Pad is a 15 W/mK silicone thermal pad measuring 120x20mm at 1.0mm thick, providing a soft, conformable gap filler that delivers efficient heat transfer between components and heatsinks for CPUs, GPUs, and other electronics.