Gelid Solutions - TC-GC-04-B GC-4-3.5g Thermal Compound
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About this product
The Gelid Solutions GC-4 is a 3.5g thermal compound featuring enhanced micron-particle synthetic thermal filler for over 8.5W/mK thermal conductivity, providing ultra-efficient, non-electrically-conductive heat transfer for CPUs, GPUs, and chipsets.
Features
Feature
High-performance thermal compound with over 8.5W/mK conductivity and non-conductive formula.
Specifications
- BrandGelid SolutionsProduct NameGelid Solutions TC-GC-04-B GC-4-3.5g Thermal CompoundTools IncludedThermal PasteTool TypeThermal PasteUPC4897025783706BSINCGCL3S72F8
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