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TG Thermal Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible “gap filler”, it compensates for height differences, making it an ideal replacement for thermal pads on graphics cards.Thermal Putty is applied either with a spatula or by hand. It can be spread over a large surface or shaped into small beads, perfectly adapting to the surface it is applied to. It compensates for height differences ranging from 0.2 to 3.0 mm, ensuring optimal thermal transfer.Choose the thermal conductivity that suits your project: Basic, Advanced, or Pro. Whether for standard applications or high-end cooling, TG Thermal Putty provides the ideal solution.
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TG Thermal Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible “gap filler”, it compensates for height differences, making it an ideal replacement for thermal pads on graphics cards.Thermal Putty is applied either with a spatula or by hand. It can be spread over a large surface or shaped into small beads, perfectly adapting to the surface it is applied to. It compensates for height differences ranging from 0.2 to 3.0 mm, ensuring optimal thermal transfer.Choose the thermal conductivity that suits your project: Basic, Advanced, or Pro. Whether for standard applications or high-end cooling, TG Thermal Putty provides the ideal solution.

Thermal Grizzly TG Putty Advance is an electrically non-conductive alternative to traditional thermal pads, specifically designed for GPU modifications and the replacement of thermal pads between the PCB and cooler. As an easily applicable and flexible gap filler, it compensates for height differences, making it ideal for replacing thermal pads on graphics cards. Typically, multiple types of thermal pads with varying heights are used in factory settings; TG Putty simplifies this by adapting to different component heights. Application can be done using the included spatulas for broad coverage or by hand (gloves recommended) by forming small beads tailored to the target surface, such as VRAM or SMD components. TG Putty effectively bridges height differences from 0.2 mm to 3.0 mm. It is available in three variants—Basic with moderate thermal conductivity, Advance with good thermal conductivity, and Pro with very good thermal conductivity—to cater to diverse cooling requirements. Before application, ensure that the target surface is thoroughly cleaned and degreased, using TG Cleaning Wipes or standard isopropanol, to achieve optimal results.

Thermal Grizzly Conductonaut is a liquid metal thermal compound designed for high-efficiency applications. Recommended for advanced users seeking top-tier heat dissipation above 8 °C. Conductonaut is a eutectic alloy of tin, gallium, and indium, offering clear temperature advantages over conventional pastes. Conductonaut comes with ideal accessories: two needle tips, two applicators, and cleaning pads

The Kryonaut thermal paste offers excellent thermal conductivity and remains stable even at high temperatures without curing – ideal for extreme cooling demands. The Kryonaut thermal paste has been optimized for "Kryonauts" and demanding cooling applications, delivering impressive durability and excellent heat dissipation. Thanks to nano-aluminum and zinc oxide, Kryonaut compensates for surface irregularities and ensures optimal contact. The surface should be thoroughly cleaned and free of grease before use. We recommend using TG Remove or TG Cleaning Wipes for cleaning. The thermal paste should be at least at room temperature when applied.
