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As far as I know the device spect says this. PLA, PETG, TPU, ABS. The heatbed temperature is 212°F (100°C), and the nozzle temperature raises up to 500°F (260°C).
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As far as I know the device spect says this. PLA, PETG, TPU, ABS. The heatbed temperature is 212°F (100°C), and the nozzle temperature raises up to 500°F (260°C).