Supermicro - X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable, LGA-4677, 350W TDP
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Specifications
- ChipsetIntel Z890Form FactorATXProcessor SocketSocket LGA 4677Wireless Networking StandardNo Wi-Fi standardNumber Of Memory Slots0Maximum Memory Supported256 gigabytes
- Key Specs
- Chipset: Intel Z890
- Form Factor: ATX (The size, arrangement, and physical configuration of the product.)
- Processor Socket: Socket LGA 4677 (Type of pin configuration that connects a CPU to a computer’s motherboard.)
- Wireless Networking Standard: No Wi-Fi standard (The wireless networking standard used by the device. Each iteration of the standard developed by the Wi-Fi Alliance corresponds to an existing IEEE 802.11 protocol; for example, standard 802.11ac (or AC) is termed Wi-Fi 5. Refers specifically to the standard the device is designed to use, but ultimately determines product interoperability and backward compatibility including previous versions.)
- Number Of Memory Slots: 0
- Maximum Memory Supported: 256 gigabytes
- Memory Type Supported: DDR5 SDRAM
- General
- Brand: Supermicro
- Model Number: MBD-X13SEI-F-O
- Product Name: Supermicro X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable, LGA-4677, 350W TDP
- Compatibility
- Chipset: Intel Z890
- Chipset Compatibility: Intel
- Form Factor: ATX (The size, arrangement, and physical configuration of the product.)
- Processor Socket: Socket LGA 4677 (Type of pin configuration that connects a CPU to a computer’s motherboard.)
- Processor Compatibility: Intel Xeon
- Slot
- Number of M.2 Slots: 0 (This interface is most commonly used for high-speed solid state drives (SSDs), and is often used in laptops due to its small size.)
- Number Of PCI-E x16 Slots: 0
- Number Of Memory Slots: 0
- Connectivity
- Wireless Connectivity: None (The manner in which a device sends data to another device over a short distance without the use of wires or cables.)
- Wireless Networking Standard: No Wi-Fi standard (The wireless networking standard used by the device. Each iteration of the standard developed by the Wi-Fi Alliance corresponds to an existing IEEE 802.11 protocol; for example, standard 802.11ac (or AC) is termed Wi-Fi 5. Refers specifically to the standard the device is designed to use, but ultimately determines product interoperability and backward compatibility including previous versions.)
- Ports
- USB Ports: None (The number and type of USB ports the product has.)
- Number of Audio Channels: Not Available (The number of discrete channels of sound output. This can be a single number or multiple numbers separated by decimal(s). The first number is the primary, horizontally directed audio channels. The number after the first decimal, if applicable, is the number of subwoofer outputs or channels. The number after the second decimal, if applicable, is the number of height or atmospheric channels designed to immerse the listener by producing overhead sound effects.)
- Dimensions
- Product Length: 312.42 millimeters (The out of box length of the item. Length is measured as the longest dimension of the item.)
- Product Width: 261.62 millimeters (The out of box width of the item. Width is measured as the horizontal distance from one side of the item to the other as it would be primarily used or placed.)
- Product Weight: 48.0 ounces (The out of box weight of the item.)
- Memory
- Maximum Memory Supported: 256 gigabytes
- Memory Type Supported: DDR5 SDRAM
- Memory Format Supported: UDIMM (Memory module size that will fit with the device.)
- Memory Speeds Supported: 4800 (The RAM's bandwidth rating supported by the device. The number refers to transfer speed. For example, 12800 would indicate that the memory has a theoretical bandwidth of 12,800 megabytes per second (MBs). The higher the number, the faster the speed.)
- Memory Slot Type: 284-pin DIMM
- Features
- RAID Support: None (A Redundant Array of Independent Disks (RAID) includes a collection of separate disks that your computer recognizes as one disk unit. Each configuration offers a different level of mirroring, striping and read/write speeds.)
- Warranty
- Warranty - Parts: Limited Warranty period (parts): 1 year
- Warranty - Labor: Limited Warranty period (labor): 3 years
- Other
- UPC: 672042519408
Supermicro X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP.
- Intel® Xeon® Scalable Processors with LGA-4677 Socket: 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP
- MPN: Intel C741® Chipset
- Type: Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
- UPC: 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs
- Country of Origin: 2 PCIe 5.0 x16; 3 PCIe 5.0 x8
Whats Included
- Supermicro X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable, LGA-4677, 350W TDP
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Supermicro X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP.
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| Pros for Supermicro - X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable, LGA-4677, 350W TDP | |||
|---|---|---|---|
| There were no pros for this product— | Overall Performance | Overall Performance, Installation Ease, BIOS Usability, Features, Compatibility | There were no pros for this product— |
| Cons for Supermicro - X13SEI-F Motherboard, 5th/4th Gen Intel® Xeon® Scalable, LGA-4677, 350W TDP | |||
| There were no cons for this product— | There were no cons for this product— | Driver Support | There were no cons for this product— |
Specs
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